----- Original Message ----- From: "Isaac OLEG" <oleg-i@wanadoo.fr> To: "Pianotech" <pianotech@ptg.org> Sent: March 08, 2003 1:00 AM Subject: RE: Epoxy Man Strikes Again > Hello, > > I can't see why the glue joint or glue zone between bridge and > soundboard can't act as a sound modifier, or filter. A too thick glue > joint certainly should. I suppose if one were to really use a pva adhesive (commonly referred to as "white glue") and if one were to make the glue-line thick enough (a mm or so) it might be possible to introduce enough compliance to affect the mechanical response of the soundboard. There would also be some structural problems since there are no adhesives except epoxy that have any mechanical strength at these thicknesses. Typical glue lines are in the neighborhood of 0.075 to 0.150 mm in thickness. Much less and there is the risk of starved glue joints, much thicker and the structural strength of most woodworking adhesives begins to break down. Modern adhesives manufacturers have improved the gap-filling qualities of their formulations with various additives so that adhesives such as Titebond and Titebond II work reasonable well even when the wood-to-wood joint fitting is not perfect. While technically thermoplastic, both of these adhesives dry hard. As Ron O has pointed out, they chip when the squeeze-out is cleaned away. The idea in fixing the bridge to the soundboard is to get a reasonably good wood-to-wood fit and a reasonably good glue bond so that the motion of the bridge is closely coupled to the soundboard. This is more easily accomplished that commonly thought. Remember that the bridge base has a relatively large surface area. The motion of the bridge is not isolated to a single point. It is, after all, a bridge. When a specific string sets the bridge in motion, that motion is felt, mechanically, over a broad expanse of the bridge. It would take an unbelievably viscous adhesive to audibly or measurable affect the energy transfer from the bridge to the soundboard. > > And the choice of the glue may change the resonnance frequencies of > the assembly too. Keeping in mind that we're really trying to keep the soundboard/rib/bridge system relatively free of specific resonances. Many things will affect the resonances found in a soundboard. Among them are changes in humidity and temperature. Even tuning the piano will cause changes in the resonances of a soundboard assembly. > > Beside I understand that the bridge and the board have to be warm > (and dry) to be glued. Do you use the hot box before gluing ? This is only true if hot animal hide glue is being used to bond the ribs and/or bridges to the soundboard. Historically, soundboards and ribs were heated to temperatures up to 120º F (approx. 50º C) to keep the hot glue from gelling prematurely. > > Epoxyes seems to be cook sometime, to attain their final hardness > temperatures as high as boiling water . I suspect we don't want to > cook our soundboards as that ! So, it's OK to heat the soundboard to 120º F (approx. 50º C) when using animal hide glue but it's a problem to raise the temperature of the wood by some fraction of a degree (by either scale) when using epoxy? Let's think this through. Epoxy adhesives are thermosetting. They cure by chemical reaction and they do generate heat as they cure. This becomes most obvious when you mix up too much and it begins to kick over (chemically cure) in the pot or can in which it was mixed before you can use all of it. If you have really mixed up too much it can begin to bubble and boil, turning itself into a real witch's brew. The heat generated by its own chemical reaction feeds on itself, accelerating the chemical reaction and the mix goes into thermal runaway. The more epoxy mass you have the faster this process takes place. Once it starts, it's too late to do anything about it. Set the container on something nonflammable, wait for it to settle down, throw the batch away and start over. This is one of the most obvious differences between slow-setting and fast-setting epoxy. Mix up equal batches of each and the fast-setting batch will start bubbling much faster than the slow-setting batch. And it's one reason why, in our shop, we use slow-setting hardeners almost exclusively. One way to control this--if you really must mix up a large batch--is to mix the resin and hardener in a wide, flat pan. This spreads the mix out, giving it more surface area to dissipate the generated heat and slow the process of thermal runaway. It also illustrates why it is not a problem in real life. The epoxy goes on so thin that, as heat is generated by the curing process, it is immediately dissipated into the wood (or whatever). Yes, the curing process will raise the temperature of the wood. But, the mass of the wood is so large compared to the mass of the epoxy that the actual increase in temperature is nominal. In other words, the wood will get warmer but the temperature increase will be so small it would be difficult to measure just how much warmer. Confused yet? I can elaborate.... Regards, Del
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